Sheet metal Cutting , Wafer cutting , Stencil ,Gasket , Solar Cell.
MS,SS,Copper,Alloy,Solar cell,PCB,Flim,Ceramic,Silicon wafer,Fuel cell.
Laser Power | 300 Watt | 500 Watt |
Max. Cutting Thickness | MS: 3mm SUS: 1.5mm |
MS: 4mm SUS: 3mm |
Power Consumptions | 5 Kw | 6 Kw |
Motion Speed | 1500 mm/sec | |
Supply voltage | 220v ,1p , 50~60 Hz | |
Cooling system | Air cooling | |
Assist Gas | N2 , O |
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Wave lenght | 1,070nm | |
Cutting bed sizing | 450*450mm, 800*450mm, 1200*2400mm, 1500*3000mm |